Introduction
Copper skiving applies the same ultra-thin fin technique as aluminum skiving but uses high-conductivity copper (~400 W/mK).
This process delivers the highest thermal performance available for both water-cooled and air-cooled systems, making it suitable for severe heat concentration, high-frequency RF, advanced ASICs, and power electronics where aluminum is insufficient.
Copper skiving allows extremely dense fins without soldering, maximizing heat transfer efficiency in demanding telecom and server applications.
